Electro-optical device, method for manufacturing electro-optical device, light guide, liquid crystal device, method for manufacturing liquid crystal device, and electronic equipment

ABSTRACT

A liquid crystal device  100  comprises a liquid crystal panel  110  and a holding member  120 . A liquid crystal driving IC  115  and chip part  116  are mounted on a substrate extension portion  111 T of the liquid crystal panel  110 . The holding member  120  comprises, on an extension facing portion  122 , a storing recess  122   a  for storing the liquid crystal driving IC  115 , and a storing recess  122   b  for storing the chip part  116.

BACKGROUND OF THE INVENTION

[0001] 1. Technical Field of the Invention

[0002] The present invention relates to an electro-optical device, amethod for manufacturing the electro-optical device, a light guide, aliquid crystal device, a method for manufacturing the liquid crystaldevice, and electronic equipment, and particularly relates to anassembly structure between an electro-optical panel substrate and aholding member or circuit board disposed along the electro-optical panelsubstrate.

[0003] 2. Description of the Related Art

[0004] Generally, with various types of electro-optical devices such asliquid crystal devices, electroluminescence devices, organicelectroluminescence devices, plasma display devices, and so forth, thereare cases wherein electronic parts such as driving ICs and the like aremounted on electro-optical panel substrates made up of glass or thelike.

[0005] For example, liquid crystal devices generally have a pair ofliquid crystal substrates with electrodes formed on the inner facesthereof and liquid crystal sandwiched therebetween, wherein theorientation state of the liquid crystal thereof is controlled bycontrolling the voltage applied to the liquid crystal, therebymodulating incident light to the liquid crystal. With this liquidcrystal device, generally liquid crystal driving ICs are used forcontrolling the voltage applied to the liquid crystal, but there arecases wherein the liquid crystal driving ICs are directly mounted on theliquid crystal substrates, and cases wherein the liquid crystal drivingICs are mounted indirectly by mounting structures (flexible line boards,circuit boards, etc.) connected to the liquid crystal substrate.

[0006] Also, the liquid crystal panel itself has only a light modulatingfunction, so separate illuminating means is necessary for allowing thedisplay to be visually recognized as a liquid crystal device. An exampleof such illuminating means is a back-light for example, and thisback-light includes members such as a light guide positioned behind theliquid crystal panel along the liquid crystal substrate.

[0007] However, in recent years, there is the need to advance reductionin size and reduction in weight of liquid crystal devices even furtherin order to meet the demands for reduction in thickness and reduction inweight and so forth regarding electronic equipment, so there is the needto reduce the thickness and reduce the weight of the overall liquidcrystal device including the illuminating means such as the back-lightand so forth, and there is the need to aim for securing space within theelectronic equipment.

[0008] The present invention has been made in order to solve the aboveproblems, and accordingly it is an object thereof to provide a structurefor electro-optical equipment whereby reduction in thickness andreduction in weight can be realized, a structure of a light guide, andelectronic equipment having these. Also, it is an object thereof toprovide a manufacturing method whereby reduction in thickness andreduction in weight of electro-optical devices can be realized.

SUMMARY OF THE INVENTION

[0009] The electro-optical device according to a first invention forsolving the above problems comprises: an electro-optical panelsubstrate; an electronic part mounted on the electro-optical panelsubstrate; and a holding member disposed along the electro-optical panelsubstrate so as to cover the electro-optical panel substrate; whereinthe electronic part is positioned so as to protrude from theelectro-optical panel substrate; and wherein the holding member isprovided with a storing portion for storing the electronic part.

[0010] According to this invention, in the state that electronic part isstored in the storing portion of the holding member, the holding memberis positioned along the electro-optical panel substrate, so theelectro-optical device can be made thinner while securing the thicknessof the holding member, and accordingly the size and weight can bereduced without sacrificing the functions or rigidity of theelectro-optical device. Also, assembling by matching the electronic partto the storing portion facilitates positioning of the electro-opticalpanel substrate and the holding member, and accordingly assembly can beperformed in a sure and speedy manner.

[0011] Now, various chip parts such as a liquid crystal driving IC,conductor, inductor, resistor, etc., or light-emitting elements such asLEDs may be contained for the electronic part, and any of these mayserve.

[0012] Also, a space capable of accommodating the electronic part issufficient for the storing portion, and may be any of a recess, groove,opening, notch, or the like.

[0013] With the present invention, the holding member is suitablyconfigured so as to function as a light guide.

[0014] With the present invention, the holding member preferablycomprises a light source storing portion for storing a light source.

[0015] With the present invention, areas surrounding the mounting areaof the electronic part on the electro-optical panel substrate arepreferably covered with a protective material having a flat face.

[0016] Also, the electro-optical device according to a second inventioncomprises: an electro-optical panel substrate; an electronic partmounted on the electro-optical panel substrate; and a holding memberdisposed along the electro-optical panel substrate so as to cover theelectro-optical panel substrate; wherein the electro-optical panelsubstrate is covered with a protective material having a flat face; andwherein the electronic part is positioned so as to protrude from theprotective material on the electro-optical panel substrate; and whereinthe holding member is provided with a storing portion for storing theelectronic part.

[0017] According to this invention, the electro-optical panel substratewhere the electronic part is mounted is covered with a protectivematerial having a flat face, so configurations for preventing contactbetween the protective material and the holding member do not readilyinterfere with reduction in the thickness of the electro-optical device.Also, even in the event that the holding member comes into contact withthe surface of the protective material, the face of the protectivematerial is formed flat, so there is no application of local stress fromthe holding member to the electro-optical panel substrate, therebypreventing damage to the electro-optical panel substrate, and also theelectro-optical panel substrate can be supported over a wide area by theholding member.

[0018] With the present invention, the holding member is preferablyconfigured so as to function as a light guide.

[0019] With the present invention, the holding member preferablycomprises a light source storing portion for storing a light source.

[0020] Further, the electro-optical device according to a thirdinvention comprises: an electro-optical panel substrate; an electronicpart mounted on the electro-optical panel substrate; and a holdingmember disposed along the electro-optical panel substrate so as to coverthe electro-optical panel substrate; wherein a plurality of theelectronic parts are mounted on the electro-optical panel substrate; andwherein the plurality of electronic parts are positioned so as toprotrude from the electro-optical panel substrate; and wherein theholding member is provided with a storing portion for storing theplurality of electronic parts.

[0021] With the present invention, the holding member is preferablyconfigured so as to function as a light guide.

[0022] With the present invention, the holding member preferablycomprises a light source storing portion for storing a light source.

[0023] With the present invention, a plurality of storing portions arepreferably provided corresponding to the plurality of electronic parts.

[0024] With the present invention, the arrangement preferably comprisesa plurality of the electronic parts having mutually different shapes ordimensions, and comprising a plurality of the storing portionsconfigured with mutually different shapes or dimensions so as to matchthe forms of the corresponding electronic parts. According to thismeans, even in the event that multiple storing portions are formed, thestoring portions have shapes or dimensions corresponding to the shapesor dimensions of the multiple electronic parts, so the assembly attitudeof the electro-optical panel substrate and the holding member can bedetermined without hesitation.

[0025] With the present invention, the storing portion is preferablyconfigured so as to store the plurality of electronic parts together.According to this means, even in the event that multiple electronicparts are formed on the electro-optical panel substrate, and even in theevent that these have different shapes and dimensions, the structure ofthe holding member can be made simple.

[0026] With the present invention, the storing portion is preferablyformed in the shape of a groove. Groove-shaped storing portions can bereadily formed.

[0027] Also, the electro-optical device according to a fourth inventioncomprises: an electro-optical panel substrate; an electronic partmounted on the electro-optical panel substrate; and a holding memberdisposed along the electro-optical panel substrate so as to cover theelectro-optical panel substrate; wherein the electronic part ispositioned so as to protrude from the electro-optical panel substrate;and wherein the holding member is provided with an abutting portionwhich abuts the electro-optical panel substrate for positioning, and astoring portion for storing the electronic part in a state wherein theelectro-optical panel substrate is positioned by the abutting portion.

[0028] According to this invention, the configuration is such thatpositioning the holding member by abutting the abutting portion againstthe electro-optical panel substrate causes the electronic part mountedon the electro-optical panel substrate to be stored within the storingportion of the holding member, so assembly work can be facilitated.Here, in the event that multiple electro-optical panel substrates arecontained in the electro-optical device, the electro-optical panelsubstrate which abuts the abutting portion and the electro-optical panelsubstrate upon which the electronic parts are mounted may be the same ordifferent articles.

[0029] With the present invention, the holding member is preferablyconfigured so as to function as a light guide

[0030] With the present invention, the holding member preferablycomprises a light source storing portion for storing a light source.

[0031] With the present invention, the holding member preferablycomprises an elastic holding portion for holding the electro-opticalpanel substrate in a state abutted against the abutting portion.

[0032] With the present invention, the holding member is preferablyprovided with a recessed structure for storing the electro-optical panelsubstrate, containing the abutting portion.

[0033] Further, the electro-optical device according to a fifthinvention comprises: an electro-optical panel substrate; an electronicpart mounted on the electro-optical panel substrate; a holding memberdisposed along the electro-optical panel substrate so as to cover theelectro-optical panel substrate, the holding member functioning as alight guide; and a circuit board positioned along the holding member;wherein the electronic part is positioned so as to protrude from theelectro-optical panel substrate; and wherein a light source is mountedto the circuit board so as to protrude toward the side of the holdingmember; and wherein the holding member is provided with a storingportion for storing the electronic part, and a light source storingportion for storing the light source.

[0034] According to this invention, electronic parts mounted to theelectro-optical panel substrate are stored in the storing portion of theholding member, and a light source mounted to the circuit board isstored in the light source storing portion, so the overall thickness ofthe electro-optical device can be further reduced.

[0035] With the above inventions, the light source storing portion ispreferably configured so as to accommodate the light source from theopposite side of the electro-optical panel substrate as to the holdingmember.

[0036] With the present invention, there are cases wherein the lightsource storing portion is assembled in a state with the light sourcestored therein. The light source may be mounted to members other thanthe holding member, such as the electro-optical panel substrate orcircuit board, but there are also cases of being attached within thelight source storing portion of the holding member.

[0037] Also, the electro-optical device according to a sixth inventioncomprises: an electro-optical panel substrate; a first electronic partmounted on the electro-optical panel substrate; and a holding memberdisposed along the electro-optical panel substrate so as to cover theelectro-optical panel substrate; wherein the electronic part ispositioned so as to protrude from the electro-optical panel substrate;and wherein the holding member is provided with a storing portion forstoring another electronic part at an area adjacent to the electronicpart.

[0038] According to this invention, storing another electronic part in astoring portion formed to the holding member positions the electronicpart on the electro-optical panel substrate adjacent thereto, sopositioning of the member upon which is mounted the other electronicpart is facilitated.

[0039] With the present invention, there are cases wherein the otherelectronic part is attached to the other storing portion.

[0040] Further, the electro-optical device according to a seventhinvention comprises: an electro-optical panel substrate; an electronicpart mounted on the electro-optical panel substrate; and a circuit boarddisposed along the electro-optical panel substrate so as to cover theelectro-optical panel substrate; wherein the electronic part ispositioned so as to protrude from the electro-optical panel substrate;and wherein another electronic part is mounted to the circuit board atan area adjacent to the electronic part.

[0041] According to this invention, diposing the circuit board along theelectro-optical panel substrate naturally positions adjacent to eachother the electronic part on the electro-optical panel substrate and theother electronic part on the circuit board, so positioning of theelectro-optical panel substrate and the circuit board becomes easier.

[0042] With the present invention, a holding member is preferablypositioned between the electro-optical panel substrate and the circuitboard, the holding member comprising a storing portion for storing theelectronic part and the other electronic part adjacent thereto.

[0043] With the present invention, the holding member preferably has alight-guiding function.

[0044] With the present invention, the other electronic part preferablyis a light source.

[0045] With the present invention, one of the electronic part and theother electronic part is preferably positioned between a pair of theother.

[0046] According to these means, the configuration is such that one ofthe electronic parts is positioned between a pair of the otherelectronic parts, further facilitating positioning of theelectro-optical panel substrate and the circuit board.

[0047] Also, the electro-optical device according to another inventioncomprises: an electro-optical panel substrate, an electro-optical paneldriving IC mounted onto the electro-optical panel substrate; and aholding member disposed along the electro-optical panel substrate so asto cover the electro-optical panel substrate; wherein theelectro-optical panel driving IC is positioned protruding from theelectro-optical panel substrate, and the holding member has a recess forstoring the electro-optical panel driving IC.

[0048] With the present invention, the holding member preferablyfunctions as a light guide.

[0049] With the present invention, a chip part is preferably mounted tothe electro-optical panel substrate, the chip part being positionedprotruding from the electro-optical panel substrate, and a recess beingformed on the holding member for storing the chip part.

[0050] With the present invention, the recess is preferably a grooveprovided in the holding member.

[0051] With the present invention, a light source is preferably providedat the holding member side at the recess.

[0052] Also, the electro-optical device according to yet anotherinvention comprises: an electro-optical panel substrate, anelectro-optical panel driving IC mounted onto the electro-optical panelsubstrate; and a holding member disposed along the electro-optical panelsubstrate so as to cover the electro-optical panel substrate; whereinthe electro-optical panel driving IC is positioned protruding from theelectro-optical panel substrate, and the holding member has a notchprovided from the outside at an area where the electro-optical paneldriving IC is not situated.

[0053] With the present invention, the holding member preferablyfunctions as a light guide.

[0054] With the present invention, a light source is preferably storedin the notch.

[0055] Also, the electro-optical device according to yet anotherinvention comprises: an electro-optical panel substrate, anelectro-optical panel driving IC mounted onto the electro-optical panelsubstrate; and a holding member disposed along the electro-optical panelsubstrate so as to cover the electro-optical panel substrate; whereinthe electro-optical panel driving IC is positioned protruding from theelectro-optical panel substrate; and wherein the holding member has ahole provided at an area where the electro-optical panel driving IC isnot situated.

[0056] Next, the method for manufacturing the electro-optical deviceaccording to the first invention comprises: a step for mounting anelectronic part on an electro-optical panel substrate; and a step fordisposing a holding member along the electro-optical panel substrate soas to cover the electro-optical panel substrate; wherein the holdingmember is provided beforehand with a storing portion for storing theelectronic part, and wherein the holding member is positioned such thatthe storing portion accommodates the electronic part.

[0057] With the present invention, the storing portion preferablyaccommodates the electronic part in the state that an abutting portionof the holding member which abuts the electro-optical panel substratefor positioning is abutting the electro-optical panel substrate.

[0058] With the present invention, the electro-optical panel substrateis preferably covered with a protective material following mounting theelectronic part on the electro-optical panel substrate.

[0059] With the present invention, the protective material in anunhardened state is preferably applied onto the electro-optical panelsubstrate, following which the protective material is subjected tosmoothing processing for smoothing and subsequently hardened.

[0060] With the present invention, the smoothing processing ispreferably performed by inclining the electro-optical panel substrateand causing the applied protective material to flow.

[0061] With the present invention, the applied protective materialpreferably is mechanically smoothed in the smoothing processing.

[0062] With the present invention, a sheet-shaped protective material ispreferably positioned on the electro-optical panel substrate, followingwhich the sheet-shaped protective material is either dissolved orsoftened, and following which the protective material is hardened.

[0063] With the present invention, the sheet-shaped protective materialis preferably provided with an opening at the mounting area of theelectronic part on the electro-optical panel substrate.

[0064] Also, the method for manufacturing the electro-optical deviceaccording to the second invention comprises: a step for mounting anelectronic part on an electro-optical panel substrate; and a step fordisposing a circuit board along the electro-optical panel substrate soas to cover the electro-optical panel substrate; wherein, anotherelectronic part is mounted to an area adjacent to the electronic part onthe circuit board, and the circuit board is disposed along theelectro-optical panel substrate such that the electronic part and theother electronic part are positioned adjacent to each other.

[0065] With the present invention, a holding member provided with astoring portion for storing the electronic part and the other electronicpart adjacent thereto is preferably disposed between the electro-opticalpanel substrate and the circuit board.

[0066] With the present invention, both the electronic part and theother electronic part are preferably mounted such that one electronicpart is positioned between a pair of the other electronic part.

[0067] Next, the light guide according to the present invention is alight guide used in a state disposed so as to cover an electro-opticalpanel substrate; comprising a storing portion for storing an electronicpart mounted on the electro-optical panel substrate and positioned so asto protrude from the electro-optical panel substrate.

[0068] With the present invention, the storing portion is preferablyconfigured so as to be capable of storing the electronic part from atleast either the front or rear side, and another storing portion isprovided so as to be capable of storing a light source from the other,front or rear side.

[0069] With the present invention, the storing portion is preferablyconfigured so as to be capable of storing the electronic part from atleast either the front or rear side, and the other storing portion isarranged to be capable of storing the light source from the other side,front or rear.

[0070] With the present invention, the light guide preferably furthercomprises an abutting portion which abuts the electro-optical panelsubstrate for positioning.

[0071] With the present invention, the light guide preferably furthercomprises an elastic holding portion for holding the electro-opticalpanel substrate against the abutting portion in the abutted state.

[0072] With the present invention, the light guide preferably furthercomprises a recess structure containing the abutting portion, forstoring the electro-optical panel substrate.

[0073] Also, another light guide is a light guide disposed along anelectro-optical panel substrate upon which an electro-optical paneldriving IC is mounted, wherein the electro-optical panel driving IC isattached to the electro-optical panel in a manner protruding therefrom,and a recess is formed in the holding member for storing the protrudingelectro-optical panel driving IC.

[0074] Further, a different light guide is a light guide disposed alongan electro-optical panel substrate upon which an electro-optical paneldriving IC is mounted, wherein the electro-optical panel driving IC isattached to the electro-optical panel in a manner protruding therefrom,and a notch is provided to the holding member from the outside at anarea where the electro-optical panel driving IC is not situated.

[0075] Next, the liquid crystal device according to the presentinvention is an electro-optical device according to any of the aboveinventions, wherein liquid crystal is provided between a pair of liquidcrystal panel substrates which are the electro-optical panel substrates.

[0076] Also, another liquid crystal device comprises: a pair of liquidcrystal panel substrates with liquid crystal sandwiched therebetween; anelectronic part mounted to a substrate extension portion on at least oneof the pair of liquid crystal panel substrates which extends furtheroutwards than the outer shape of other the liquid crystal panelsubstrate; and a holding member provided along the liquid crystal panelsubstrate for covering the liquid crystal panel substrate; wherein theelectronic part is positioned so as to protrude from the substrateextension portion; and wherein the substrate extension portion iscovered with a protective material having a smooth surface; and whereinthe holding member is provided with a storing portion for storing theelectronic part.

[0077] The method for manufacturing the liquid crystal device accordingto the present invention is a method for manufacturing theelectro-optical device according to any of the above inventions, whereinliquid crystal is provided between a pair of liquid crystal panelsubstrates which are the electro-optical panel substrates.

[0078] Next, the electronic equipment according to the present inventioncomprises: the electro-optical device according to any of the aboveinventions, and control means for controlling the electro-opticaldevice.

[0079] Also, the electronic equipment according to the present inventioncomprises: the liquid crystal device according to any of the aboveinventions, and control means for controlling the liquid crystal device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0080]FIG. 1 is a disassembled perspective view illustrating thestructure of a liquid crystal device according to a first embodiment ofthe present invention.

[0081]FIG. 2 is a disassembled perspective view illustrating thestructure of a liquid crystal panel making up the liquid crystal deviceaccording to the first embodiment.

[0082]FIG. 3 is a longitudinal-sectional view (a) showing, with regardto the liquid crystal device according to the first embodiment, alongitudinal-section along line A-A in FIG. 1, a longitudinal-sectionalview (b) showing a cross-section along line B-B in FIG. 1, and alongitudinal-sectional view (c) showing a cross-section along line C-Cin FIG. 1.

[0083]FIG. 4 is a disassembled perspective view of the structure of theliquid crystal device 200 according to the second embodiment of thepresent invention.

[0084]FIG. 5 is a longitudinal-sectional view (a) showing, with regardto the liquid crystal device according to the first embodiment, alongitudinal-section along line A-A in FIG. 4, a longitudinal-sectionalview (b) showing a cross-section along line B-B in FIG. 4, and alongitudinal-sectional view (c) showing a cross-section along line C-Cin FIG. 4.

[0085]FIG. 6 is a disassembled perspective view of the structure of aliquid crystal device according to a variation of the second embodiment.

[0086]FIG. 7 is a longitudinal-sectional view illustrating thecross-section along line VII-VII in FIG. 6.

[0087]FIG. 8 is a longitudinal-sectional view illustrating the structureof the liquid crystal device according to a third embodiment of thepresent invention.

[0088]FIG. 9 is a longitudinal-sectional view illustrating the structureof the liquid crystal device according to a fourth embodiment of thepresent invention.

[0089]FIG. 10 is a longitudinal-sectional view illustrating thecross-section orthogonal to the cross-section shown in FIG. 9.

[0090]FIG. 11 is a longitudinal-sectional view illustrating thestructure of the liquid crystal device according to a fifth embodimentof the present invention.

[0091]FIG. 12 is a longitudinal-sectional view illustrating thecross-section orthogonal to the cross-section shown in FIG. 11.

[0092]FIG. 13 is a longitudinal-sectional view illustrating thestructure of the liquid crystal device according to a sixth embodimentof the present invention.

[0093]FIG. 14 is a longitudinal-sectional view illustrating thecross-section orthogonal to the cross-section shown in FIG. 13.

[0094]FIG. 15 is a disassembled perspective view illustrating thestructure of the configuration example 1.

[0095]FIG. 16 is a disassembled perspective view illustrating thestructure of the configuration example 2.

[0096]FIG. 17 is a disassembled perspective view illustrating thestructure of the configuration example 3.

[0097]FIG. 18 is a disassembled perspective view illustrating thestructure of the configuration example 4.

[0098]FIG. 19 is a disassembled perspective view illustrating thestructure of the configuration example 5.

[0099]FIG. 20 is a disassembled perspective view illustrating thestructure of the configuration example 6.

[0100]FIG. 21 is a disassembled perspective view illustrating thestructure of the configuration example 7.

[0101]FIG. 22 is a process -describing diagram illustrating proceduresfor the mold method 1.

[0102]FIG. 23 is a process-describing diagram illustrating proceduresfor the mold method 2.

[0103]FIG. 24 is a process-describing diagram illustrating proceduresfor the mold method 3.

[0104]FIG. 25 is a schematic configuration diagram illustrating thecircuit configuration of the electronic equipment according to thepresent embodiment.

[0105]FIG. 26 is a schematic configuration diagram illustrating anexternal view of a cellular telephone as an example of the electronicequipment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0106] Next, the electro-optical device, the method for manufacturingthe electro-optical device, the light guide, the liquid crystal device,the method for manufacturing the liquid crystal device, and theelectronic equipment, according to the present invention, will bedescribed in detail according to an embodiment with reference to theattached drawings.

[0107]FIG. 1 is a disassembled perspective view of the structure of aliquid crystal device 100 according to the present invention, FIG. 2 isa disassembled perspective view illustrating the structure of a liquidcrystal panel 110 making up part of the liquid crystal device 100, andFIG. 3 is a cross-sectional view showing a cross-section along line A-Ain FIG. 1(a), a cross-section along line B-B in FIG. 1(b), and across-section along line C-C in FIG. 1(c).

[0108] The liquid crystal device 100 has a liquid crystal panel 110 witha later-described structure, and a holding member 120 formed ofsynthetic resin or the like. The liquid crystal panel 110 and theholding member 120 are attached as appropriate using, for example,adhesive tape (two-faced tape) not shown in the drawings, adhesiveagent, an engaging structure, or the like.

[0109] The liquid crystal panel 110 is formed by sealing a firstsubstrate 111 and a second substrate 112 formed of glass, plastic, etc.,with a sealing material introduced therebetween, and injecting liquidcrystal not shown in the drawings from an opening in the sealingmaterial 113 following which the opening is sealed off with sealingmaterial 114. The sealing material 113 is formed on the inner face ofthe first substrate 111 or second substrate 112 using printingtechnology such as screen printing for example. The first substrate 111and second substrate 112 have a predetermined gap (e.g., 5 to 10 μm)stipulated therebetween, by spacers placed between the substrates orwithin the sealing material 113.

[0110] Multiple parallel electrodes formed so as to extend in apredetermined direction are formed in a stripe-like manner on the innerface of the first substrate 111 (the face facing the second substrate112), and multiple parallel electrodes formed so as to extend in adirection orthogonal to that of the electrodes of the above firstsubstrate 111 are formed in a stripe-like manner on the inner face ofthe second substrate 112 (the face facing the first substrate 111). Theintersections of the electrodes form pixels, and the pixels are arrayedvertically and horizontally in a matrix so as to make up the liquidcrystal driving area.

[0111] A rectangular substrate extension portion 111T is provided on thefirst substrate 111 extending outwards from the outer shape of thesecond substrate 112, and wiring patterns 111 a, 111 b, and 111 celectroconductively connected to unshown electrode patterns formed onthe first substrate 111 and second substrate 112 on the inner side ofthe sealing material 113 are extended and formed onto the surface of thesubstrate extension portion 111T.

[0112] An input wiring pattern 111 d is formed on the surface of thesubstrate extension portion 111T separately from the wiring patterns 111a, 111 b, and 111 c, and a liquid crystal driving IC 115 comprising asemiconductor chip on which an integrated circuit has been formed and asurface mounting type chip part 116 formed of a surface-mounting typecapacitor, inductor, resistor, etc., are mounted on the wiring patterns111 a, 111 b, 111 c, and input wiring pattern 111 d, with anisotropicconductive films 119A and 119B shown in FIG. 2 introduced therebetween,thereby forming a so-called COG (Chip-On-Glass) liquid crystal device.The liquid crystal driving IC 115 and chip part 116 both correspond tothe aforementioned electronic parts. The electronic parts also includelater-described light-emitting elements configuring light sources suchas LEDs (Light-Emitting Diodes) and LDs (Laser Diodes).

[0113] The anisotropic conductive films 119A and 119B are fabricated bydispersing fine electroconductive particles in a resin base material,and fix the liquid crystal driving IC 115 and chip part 116 onto thesubstrate in a state of having electroconductivity only in the thicknessdirection thereof, by performing thermocompression (subjected to heatingprocessing in a compressed state) to the liquid crystal driving IC andchip part 116.

[0114] Also, mounted on the edge of the substrate extension portion 111Tis a wiring member 117 formed of a flexible wiring board or a TAB (TapeAutomated Bonding) substrate or the like, so as to beelectroconductively connected to the aforementioned input wiring pattern111 d. This wiring member 117 is either mounted across the same type ofanisotropic conductive film as that described above, or across ananisotropic conductive layer with approximately the same structureprovided upon the wiring member 117 itself.

[0115] Note that the wiring member 117 may contain only a wiring patternsimply extended from external circuits, or there may be a predeterminedcircuit formed upon the wiring member 117 itself. In the case of thelatter, an electronic part such as an integrated circuit chip,surface-mounted type circuit device, light-emitting element, etc., arenormally mounted on the wiring member 117.

[0116] A mold material (protective material) 118 formed of a moldmaterial of silicon resin or the like or a ultraviolet-light hardeningmold material or the like covers the substrate surface of the substrateextension portion 111T. This mold material 118 protects the wiringpatterns formed on the surface of the substrate extension portion 111T,and prevents corrosion and the like thereof. Conventionally, unhardenedmold material is normally just coated on the substrate extension portion111T and hardened, so as to cover the substrate extension portion 111Twith different thickness at different parts, but with the presentembodiment, the mold material 118 has an approximately uniform thicknesson the substrate extension portion 111T, and is formed so as to have asmooth overall surface, due to a later-described method. Also, theabove-described liquid crystal driving IC 115 and chip part 116 are in astate of protruding beyond the surface of the mold material 118.

[0117] At the liquid crystal panel 110, a polarizing plate 111P isapplied to the outer surface of the first substrate 111, and apolarizing plate 112P is applied to the outer surface of the secondsubstrate 112.

[0118] The protective member 120 is formed on an overall plate shape inthe example shown in the figure, and comprises a panel supportingportion 121 which is overlaid with the liquid crystal driving area ofthe liquid crystal panel 100, and an extension facing portion 122configured thickly so as to be overlaid with the substrate extensionportion 111T. A recessed groove 121 a for storing the second substrate112 is formed on the panel supporting portion 121. The opposing innerfaces 121 b and 121 c facing the recessed groove 121 a are configured soas to opposingly face one another at the edge of the second substrate112 from both sides, to restrict the second substrate 112 in the planedirection.

[0119] The extension facing portion 122 of the holding member 120 isformed so as to be overall thicker than the panel supporting portion121, and is configured so as to loosely fit to the substrate extensionportion 111T. Storing recesses 122 a and 122 b are provided to theextension facing portion 122 for storing the liquid crystal driving IC115 and chip part 116. The plane surface of the extension facing portion122 may be configured so as to face the mold material 118 on thesubstrate extension portion 111T with a slight gap introducedtherebetween, or to come into planar contact with the mold material 118.

[0120] The holding member 120 functions as a panel frame (holding meansfor the liquid crystal panel) provided for holding the liquid crystalpanel 110 and fixing it onto the circuit board or within the electronicequipment, but may also be arranged to function as a light guide of aback-light. In this case, the holding member 120 is formed of atransparent material such as transparent acrylic resin or the like.Also, a reflecting plate (white polyester film or the like) may beapplied to the outer face of the holding member 120 opposite to thesecond substrate 112, or a reflecting layer may be formed by printing orthe like. Forming minute recesses and protrusions on the outer face ofthe holding member 120 can also substitute as the reflecting layer.Further, the light source such as an LED or the like casing light intothe light guide may be provided externally such as mounted on thecircuit board, or may be directly attached to the liquid crystal panel110 or holding material 120.

[0121] In the present embodiment, providing the holding member 120 withthe storing recesses 122 a and 122 b for storing the liquid crystaldriving IC 115 and chip part 116 stores the liquid crystal driving ICand chip part 116 protruding from the substrate extension portion 111Twithin the storing recesses 122 a and 122 b, so the overall thickness ofthe liquid crystal device 100 can be reduced while securing sufficientthickness for the holding member 120 (the thickness in the verticaldirection in FIG. 1 through FIG. 3). Also, the overall volume of theliquid crystal device 100 can be reduced, so weight can be reduced aswell.

[0122] Also, due to the storing recesses 122 a and 122 b provided to theholding member 120, the liquid crystal panel 110 and the holding member120 can be assembled by matching the liquid crystal driving IC 115 andchip part 116 to the storing recesses 122 a and 122 b, which facilitatespositioning of the two and allows assembly to be performed in a sure andspeedy manner, doing away with mistakes in the direction of assembly ofthe liquid crystal panel 110 and the holding member 120 and so forth.Particularly, the liquid crystal driving IC 115 and chip part 116 havedifferent shapes and dimensions, and the storing recesses 122 a and 122b are formed so as to have shapes and dimensions matching the shapes anddimensions thereof (i.e., the liquid crystal driving IC 115 has a largeflat shape, and the chip part 116 has a small flat shape, so the planarform of the storing recess 122 a is large, and the planar form of thestoring recess 122 b is small), so mistakes at the time of assembly canbe further reduced, allowing assembly to be performed in a sure andspeedy manner.

[0123] With the present embodiment, a recessed groove 121 a foraccommodating the second substrate 112 is provided on the holding member120, so assembly can be performed by matching the liquid crystal panel120 to the recessed groove 121 a further facilitating the assembly work.As shown in FIG. 3, the opposing inner faces 121 b and 121 c of therecessed groove 121 a are configured so as to come into contact with theedge of the second substrate 112, such that with the example shown inthe figure for example, the inner face 121 b can be used as an abuttingface, which is abutted against the edge face of the second substrate112, to perform positioning.

[0124] With the present embodiment, mold material 118 on the substrateextension portion 111T being formed smooth means that assembly can beperformed in a state with the inner faces of the extension facingportion 122 of the holding member 120 being even closer to the substrateextension portion 111T, thereby enabling the overall thickness of theliquid crystal device 100 to be reduced even further.

[0125] Now, the mold material 118 is preferably colored. This isbecause, in the event that the mold material 118 is transparent, whetheror not the mold material is covering the substrate extension portion111T is not so readily discernible. The mold material 118 is preferablycolored white. This is because this facilitates discovery of impuritiesor foreign material in the mold material 118 or adhering to the surfacethereof, and such impurities or foreign material cannot be readilydiscovered in the event that the color is black, for example.

[0126] Also, mixing filler for coloring into the holding member 120facilitates positioning at the time of assembling the liquid crystalpanel 110 and the holding member 120, and also facilitates discovery ofinclusion of foreign matter or the like into the liquid crystal device100. Now, in the event of using the holding member 120 as a light guide,this coloring preferably is performed to an extent that there are noadverse effects on the light guiding capabilities.

[0127] Also, with the above embodiment, the substrate extension portion111T is covered by the mold material 118, but the mold material 118 isnot indispensable.

[0128] While the present embodiment has polarizing plates respectivelydisposed on the outer faces of the first substrate and second substrate,there are cases wherein polarizing plates are not necessary depending onthe liquid crystal mode, and in such cases, there is no need to providethe polarizing plates. Also, there are also cases wherein a polarizingplate is positioned only on the observing side, and cases wherein phasedifference plates or the like are provided in addition to the polarizingplates, so in such cases, the configuration will correspond to the case.The above information holds exactly the same for all of the liquidcrystal devices described below, and accordingly, no mention will bemade of the polarizing plates in the following description and thepolarizing plates will be omitted from the drawings.

[0129] The liquid crystal device 200 according to a second embodiment ofthe present invention will be described with reference to FIG. 4 andFIG. 5. FIG. 4 is a disassembled perspective view of the liquid crystaldevice 200, and FIG. 5 is a longitudinal-sectional view (a) showing across-section along line A-A in FIG. 4, a longitudinal-sectional view(b) showing a cross-section along line B-B in FIG. 4, and alongitudinal-sectional view (c) showing a cross-section along line C-Cin FIG. 4.

[0130] With the liquid crystal device 200 according to this embodiment,the first substrate 211 and second substrate 212 of the liquid crystalpanel 210, the seal material 213, the sealing material 214, liquidcrystal driving IC 215, wiring member 217 (omitted in FIG. 4, see FIG.5) and mold material 218, panel supporting portion 221 of the holdingmember 220, recessed groove 221 a, inner faces 221 b and 221 c, andstoring recesses 222 a and 222 b of the extension facing portion 222,are exactly the same as those in the above first embodiment, sodescription thereof will be omitted.

[0131] With the present embodiment, only the liquid crystal driving IC215 is mounted on the substrate extension portion 211T of the liquidcrystal panel 210. The wiring patterns 211 a, 211 b, 211 c, and inputwiring pattern 211 d provided to the on the substrate extension portion211T are exactly the same as those in the first embodiment, and all ofthese patterns are electroconductively connected to the liquid crystaldriving IC 215. Also, a storing recess 222 a alone is formed to thelower face of the holding member 220 in the diagram so as to store theliquid crystal driving IC 215.

[0132] Notched storing recesses 222 c and 222 d are formed to theextension facing portion 222 of the holding member 220 on the oppositeside to the liquid crystal panel 210 at the corners of the plate. Thesestoring recesses 222 c and 222 d are configured to be positioned aboveboth right and left sides of the liquid crystal driving IC 215 on thesubstrate extension portion 211T when the holding member 220 isassembled so as to cover the liquid crystal panel 210.

[0133] A circuit board 230 is positioned above the holding member 220.The circuit board 230 may be a thick printed circuit board (PCB) with abase of glass epoxy resin or the like, for example, or may be a flexiblecircuit board (FPC) with a base of polyimide resin or the like. A pairof light-emitting elements 231 and 232 such as LEDs or the like ismounted on the lower face of the circuit board 230 in the figure. Thelight-emitting elements 231 and 232 are configured so as to be lit basedon power source potential and control signals supplied from a circuitformed on the circuit board 230.

[0134] The pair of light-emitting elements 231 and 232 such as LEDs orthe like mounted on the circuit board 230 are configured so as to bestored in the storing recesses 222 c and 222 d of the holding member 220when the holding member 220 and circuit board 230 are assembled in alayered manner, as shown in FIG. 5(c). Light emitted from thelight-emitting elements 231 and 232 is guided into the holding member220 serving as a light guide, via the inner faces of the storingrecesses 222 c and 222 d of the holding member 220. The light led intothe holding member 220 is cast onto the liquid crystal panel 210 using aknown light guiding structure (not shown, but may be, for example, aprinted layer, reflecting layer reflecting palate or a like reflectionarrangement, scattering by a roughened structure, total reflection offof an inclined face, and so forth).

[0135] With this liquid crystal device 200, the holding member 220 ispositioned above the liquid crystal panel 210, and further the circuitboard 230 is positioned above the holding member 220. At this time, therecessed groove 221 a of the holding member 220 is positioned so as toaccommodate the second substrate 212 of the liquid crystal panel 210,and the storing recess 222 a of the holding member 220 stores the liquidcrystal driving IC 215 protruding from the substrate extension portion211T. Also, the circuit board 230 is positioned above the holding member220 such that the light-emitting elements 231 and 232 of the circuitboard 230 are accommodated within the storing recesses 222 c and 222 dof the holding member 220 as described above. Incidentally, the liquidcrystal panel 210, the holding member 220, and the circuit board 230,preferably are mutually fixed by adhesive tape not shown in thedrawings, adhesive agent, an engaging structure, or the like.

[0136] With the present embodiment, in addition to the advantagesdescribed with the first embodiment, the light-emitting elements 231 and232 mounted on the circuit board 230 are accommodated within the storingrecesses 222 c and 222 d of the holding member 220, thereby yielding theadvantage that the overall thickness of the liquid crystal device 200comprising the liquid crystal panel 210, the holding member 220, and thecircuit board 230, can be further reduced. Also, the correspondingstructure of the light-emitting elements 231 and 232 and thecorresponding storing recesses 222 c and 222 d facilitates positioningof the holding member 220 and the circuit board 230, therebyfacilitating assembly.

[0137] With this second embodiment, the form of the storing recesses 222c and 222 d formed in the holding member 220 can be selected asappropriate. For example, with the above example these are formed asnotched recesses, but may be formed as notched openings as shown in FIG.6 and FIG. 7. Now, FIG. 6 is a disassembled perspective view of thestructure of a liquid crystal device 200′ which is a variation of thepresent embodiment, and FIG. 7 is a cross-sectional view illustratingthe cross-section along line VII-VII in FIG. 6. In this variation, thereference numerals used for denoting the same parts are the same as inthe second embodiment, and description thereof will be omitted.

[0138] With the liquid crystal device 200′ which is a variation, notchedopening storing recesses 222 c′ and 222 d′ are formed at the left andright corner portions of the extension facing portion 222′ of theholding member 220′. The configuration is such that when the circuitboard 230 is positioned in the proper position above the holding member220′, the light-emitting elements 231′ and 232′ mounted on the circuitboard 230 are accommodated in the storing openings 222 c′ and 222 d′.

[0139] With this variation, forming the storing openings 222 c′ and 222d′ in the holding member 220′ allows a storing space approximately equalto the thickness of the extension facing portion 222′ of the holdingmember 220′ to be obtained, so light-emitting elements 231′ and 232′greater (or more specifically, thicker) than the light-emitting elements231 and 232 in the second embodiment can be accommodated.

[0140] Next, the liquid crystal device 300 according to a thirdembodiment of the present invention will be described with reference toFIG. 8. The liquid crystal device 300 has a liquid crystal panel 310 anda holding member 320 covering the liquid crystal panel 310, as with thefirst embodiment or second embodiment. The first substrate 311, thesecond substrate 312, the sealing material 313, the liquid crystaldriving IC 315, the wiring member 317, and the mold material 318 are thesame as those in the above embodiments, so description thereof will beomitted.

[0141] The holding member 320 has a panel supporting unit 321 comprisinga recessed grove 321 a and a thick extension facing portion 322. Astoring recess 322 a is formed on the extension facing portion 322 aswith the above embodiments, and a liquid crystal driving IC 315 isstored within this storing recess 322 a.

[0142] On the other hand, a storing recessed groove 321 a the same asthat of the above embodiments is provided to the panel supportingportion 321 of the holding member 320, but a hook-shaped elasticengaging portion 321 b is provided to one side of the storing recessedgroove 321 a. Also, an inner face 321 c the same as that of the aboveembodiments is formed on the other side of the storing recessed groove321 a.

[0143] With this embodiment, fitting the second substrate 312 of theliquid crystal panel 310 into the storing recessed groove 321 a causesthe elastic engaging portion 321 b to abut against the edge of thesecond substrate 312 and to elastically press against the secondsubstrate 312, so the other edge of the second substrate 312 is in astate of being pressed against the above inner face 321 c. Note that aninclined portion or beveled portion (curved portion) 321 b-1 is providedto the tip portion of the liquid crystal panel 310 side of the elasticengaging portion 321 b, so as to facilitating fitting thereof to thesecond substrate 312.

[0144] According to this embodiment, an elastic engaging portion 312 isprovided to the holding member 320 and also an inner face 321 c which isan abutting face is formed at the other side, so the liquid crystalpanel 310 can be positioned as to the holding member 320 in a planarmanner, and also both can be held by the elasticity of the elasticengaging portion 321 b. Accordingly, even easier assembly of the liquidcrystal panel 310 and the holding member 320 can be facilitated. Forexample, in the example shown in the drawing, simply lightly fitting theholding member 320 to the liquid crystal panel 310 from above completesthe assembly work. Of course, in this assembled state, the liquidcrystal driving IC 315 protruding from the substrate extension portion311T is stored within the storing recess 322 a of the holding material320.

[0145] Next, the liquid crystal device 400 according to a fourthembodiment of the present invention will be described with reference toFIG. 9 and FIG. 10. FIG. 9 is a longitudinal-section view of the liquidcrystal device 400, and FIG. 10 is a longitudinal-section view of across-section orthogonal to the cross-section shown in FIG. 9. Theliquid crystal device 400 has a liquid crystal panel 410, a holdingmember 420 covering the liquid crystal panel 410, and a holding member430 covering the liquid crystal panel 410 from the other side.

[0146] The liquid crystal panel 410 is formed by attaching the firstsubstrate 411 to the second substrate 412 with the seal material 413 andsealing liquid crystal therewithin as with the above embodiments, andthe liquid crystal driving IC 415 and wiring member 417 are mounted onthe substrate extension portion 411T of the first substrate 411, withmold material 418 having a smooth surface covering the substrateextension portion 411T.

[0147] The panel supporting portion 421 and extension facing portion 422are provided to the holding member 420, the extension facing portion 422is formed as a thick portion facing the substrate extension portion411T, and a storing recess 422 a for storing the liquid crystal drivingIC 415 protruding from the substrate extension portion 411T is providedhere. A recessed grove 421 a is provided on the holding member 420, sothat the second substrate 412 of the liquid crystal panel 410 isaccommodated in this recessed grove 421 a.

[0148] On the other hand, the holding member 430 is configured so as tocover the overall first substrate 411, and as shown in FIG. 9, comprisesan abutting portion 430 a for abutting against the edge of the firstsubstrate 411 (in the example in the figure, the edge of the substrateextension portion 411T) and an elastic engaging portion 431 for engagingthe edge opposite to the edge where this abutting portion 430 a abuts.This first substrate 411 is positioned and held in a manner pinchedbetween the abutting portion 430 a of the holding member 430 and theelastic engaging portion 431.

[0149] As shown in FIG. 10, the holding member 420 and the holdingmember 430 each have an engaging portion 423 and an engaging portion 432which mutually engage at the side of the liquid crystal panel 410. Theconfiguration is such that the engaging of the engaging portion 423 andthe engaging portion 432 holds the holding member 420 and the holdingmember 430 together with the liquid crystal panel 410 held therebetween.

[0150] With the present embodiment, the first substrate 411 of theliquid crystal panel 410 is positioned and held by the holding member430, and the holding member 420 is engaged and held with the holdingmember 430, whereby the recessed grove 421 a of the holding member 420stores the second substrate 412 of the liquid crystal panel 410, andmoreover, the liquid crystal driving IC protruding from the substrateextension portion 411T is accommodated in the storing recess 422 a ofthe holding member 420.

[0151] Accordingly, the overall thickness of the liquid crystal device400 can be reduced, and easy assembly is facilitated. Here, one of theholding members 420 or 430 can be formed of a transparent material, tofunction as a window material (protective member of the display screen)of the liquid crystal panel 410. Also, as with the above embodiments, anarrangement may be made wherein the other of the holding members 420 and430 functions as a light guide.

[0152] Next, the liquid crystal device 500 according to a fifthembodiment of the present invention will be described with reference toFIG. 11 and FIG. 12. FIG. 11 is a longitudinal-section view of theliquid crystal device 500, and FIG. 12 is a longitudinal-section view ofa cross-section orthogonal to the cross-section shown in FIG. 11. Theliquid crystal device 500 has a liquid crystal panel 510, and holdingmembers 520 and 530.

[0153] Although details of the liquid crystal panel 510 will be omitteddue to their being the same as in the above embodiments, the article isformed by attaching the first substrate 511 to the second substrate 512with the seal material 513 and sealing liquid crystal therewithin. Theliquid crystal driving IC 515 and wiring member 517 are mounted on thesubstrate extension portion 511T. The wiring member 517 passes around tothe rear side of the liquid crystal panel 510 (the opposite side fromthe observation side), and comprises an external circuit portion 517Aconfiguring a particular circuit. Also, smooth mold material 518 coversthe substrate extension portion 511T as with the above embodiments.

[0154] The holding member 520 has a panel supporting portion 521 and athick extension facing portion 522, a recessed groove 521 a is providedon the supporting portion 521 in the same manner as described above, anda storing recess 522 a is provided on the extension facing portion 522in the same manner as described above. With this holding member 522,shock-absorbing material 525 is inserted in between the liquid crystalpanel 510 so as to wrap around the panel supporting portion 521 in theshape of a frame. This shock-absorbing material 525 is inserted betweenthe liquid crystal panel 510 and the holding member 520 including theextension facing portion 522 in the assembled state shown in the figure,and is also disposed between the storing recess 522 a and the liquidcrystal driving IC 515 stored in the storing recess 522 a. The holdingmember 520 is positioned in front of the liquid crystal panel 510(toward the observation side thereof), such that the panel supportingmember 521 functions as a window member for the display face of theliquid crystal panel 510 (as protective material for the display face).

[0155] The holding member 530 is positioned behind the liquid crystalpanel 510 (the opposite side form the observation side), and as shown inFIG. 12, has an engaging portion 532 for engaging with the engagingportion 523 of the holding member 520. The holding member 520 and theholding member 530 hold the liquid crystal panel 510 therebetween, bythe engaging of the engaging portion 523 and the engaging portion 532.The holding member 530 is configured to function as a light guide, andhas at the edge thereof a light guiding recessed portion 530 a formed asa notched opening having a half-circle planar shape.

[0156] The holding member 530 is positioned upon the circuit board 540,and a light-emitting element 541 such as an LED or the like is mountedon the circuit board 540. The light-emitting element 541 is arranged soas to be introduced into the light guiding recessed portion 530 a formedon the edge of the holding member 530. Light emitted from thelight-emitting element 541 is introduced into the holding member 530from the light guiding recessed portion 530 a, and emitted toward theliquid crystal driving area of the liquid crystal panel 510.

[0157] Next, the liquid crystal device 600 according to a sixthembodiment of the present invention will be described with reference toFIG. 13 and FIG. 14. FIG. 13 is a longitudinal-section view of theliquid crystal device 600, and FIG. 14 is a longitudinal-section view ofa cross-section orthogonal to the cross-section of the liquid crystaldevice 600 shown in FIG. 13, cut so as to pass through the substrateextension portion 611T of the liquid crystal panel 610.

[0158] The liquid crystal device 600 has a liquid crystal panel 610 andholding members 620 and 630, as with the above embodiments. The liquidcrystal panel 610 has the first substrate 611, the second substrate 612,the sealing material 613, the liquid crystal driving IC 615, and thewiring member 617, as with the above embodiments; description thereofwill be omitted.

[0159] The holding member 620 has a panel supporting unit 621 and anextension facing portion 622 as with the above embodiments, and therecessed grove 621 a is also configured in the same manner as describedabove. Also, a storing recess 622 a for the liquid crystal driving IC615 and a pair of storing openings 622 b positioned adjacent thereto areformed on the extension facing portion 622. The storing openings 622 bstore light-emitting elements 641 mounted on the circuit board 640 andpositioned so as to overlap with the holding material 620, and areconfigured such that the light-emitting elements 641 face the edge ofthe holding member 620 and light is introduced from this edge.

[0160] As with the fourth embodiment, the holding member 630 has anabutting portion 630 a for abutting against the edge of the firstsubstrate 611 of the liquid crystal panel 610 and an elastic engagingportion 631 formed on the opposite side of the abutting portion 630, andis configured so as to position and hold the liquid crystal panel 610with this abutting portion 630 a and elastic engaging portion 631.

[0161] Also, as with the fourth embodiment, the holding members 620 and630 are configured to mutually engage with the engaging portion 623 andengaging portion 632, such that the engaging of the engaging portionsholds the liquid crystal panel 610 therebetween.

[0162] With the liquid crystal device 600, the liquid crystal driving IC615 is stored in the storing recess 622 a of the holding member 620, andthe light-emitting elements 641 mounted on the circuit board 640 arestored in the storing openings 622 b formed on both the left and rightsides of the storing recess 622 a. In this example, the storing openings622 b formed on both sides of the storing recess 622 a are configured soas to communicate, and the light-emitting elements 641 are positionedadjacently on either side of the liquid crystal driving IC 615 withoutthe wall of the holding member 620 introduced therebetween. Such aconfiguration gives freedom in the relative positioning of theelectronic parts of various types such as the liquid crystal driving IC615 and light-emitting elements 641 and so forth, thus facilitatingdesign, and also allowing the overall liquid crystal device 600 to bereduced in size.

[0163] Note that the present embodiment is configured such that thestoring recess 622 a is configured so as to accommodate the liquidcrystal driving IC 615 from the liquid crystal panel 610 side, whilestoring openings 622 b are formed so as to accommodate thelight-emitting elements 641 from the circuit board 640 side, but anarrangement may be made wherein a storing recess is formed foraccommodating the light-emitting elements 641 from the circuit board 640side alone, instead of the storing openings 622 b. Conversely, a storingopening may be provided instead for the storing recessed portion 622 a.In the case of the latter, the storing portion for the liquid crystaldriving IC 615 and the storing portion for the light-emitting elements641 may be integrally configured. Such an arrangement places the pair oflight-emitting elements 641 adjacent to the liquid crystal driving IC615 on either side thereof, but even so, the point that positioning ofthe liquid crystal panel 610, holding member 620, and circuit board 630is facilitated, is basically the same as the above embodiments.

[0164] Next, other configuration examples relating to the presentinvention will be described with reference to FIG. 15 through FIG. 21.

[0165]FIG. 15 is a disassembled perspective view illustrating thestructure of the liquid crystal device 700 according to the presentinvention. The liquid crystal device 700 has a liquid crystal panel 710and a holding member 720. The liquid crystal panel 710 has the firstsubstrate 711, the second substrate 712, the sealing material 713, aswith the above embodiments, and the liquid crystal driving IC 715 andmultiple chip parts 716 a through 716 d are mounted on the substrateextension portion 711T thereof.

[0166] On the other hand, the panel supporting unit 721 and extensionfacing portion 722 are provided on the holding member 720, and therecessed grove 721 a is also formed on the panel supporting unit 721 inthe same manner as described with the above embodiments. Storingrecesses 722 a though 722 d corresponding to the liquid crystal drivingIC 715 and the chip parts 716 a through 716 e are formed in the thicklyformed extension facing portion 722.

[0167] In this configuration example, multiple electronic parts havingdifferent shapes and dimensions, such as the liquid crystal driving IC715 and the chip parts 716 a through 716 e, are mounted on the substrateextension portion 711T of the liquid crystal panel 710, and storingrecesses 722 a though 722 d having different shapes and dimensionscorresponding to the electronic parts are formed accordingly in theholding member 720. More specifically, storing recesses with deep orgreat planar shapes are formed corresponding to electronic parts havinggreat protrusion amounts (height) or planar shapes, and storing recesseswith small depth or planar shapes are formed corresponding to electronicparts having small protrusion amounts or planar shapes. Also, thestoring recesses preferably have planar forms corresponding to theplanar forms of the electronic parts (e.g., similar shapes).

[0168]FIG. 16 is a disassembled perspective view illustrating thestructure of the liquid crystal device 700′ according to configurationexample 2 of the present invention. The liquid crystal device 700′ has aliquid crystal panel 710 exactly the same as that of the aboveconfiguration example 1, and the holding member 720′ is positioned so asto overlay on the liquid crystal panel 710.

[0169] The holding member 720′ has the panel supporting portion 721′comprising the recessed groove 721 a′ the same as the configurationexample 1, but a storing groove 722 a′ different from that ofconfiguration example 1 is formed to the extension facing portion 722′.The storing groove 722 a′ is formed along the entire width of theextension facing portion 722′, so as to be able to store all of theliquid crystal driving IC 715 and multiple chip parts 716 a through 716d mounted on the substrate extension portion 711T of the liquid crystalpanel 710. In other words, the storing groove 722 a is configured so asto be able to collectively store multiple different electronic partstherein.

[0170]FIG. 17 is a disassembled perspective view illustrating thestructure of the liquid crystal device 700″ according to configurationexample 3 of the present invention. The liquid crystal device 700″ has aliquid crystal panel 710 exactly the same as that of the aboveconfiguration example 1 and configuration example 2, and the holdingmember 720″ is positioned so as to overlay on the liquid crystal panel710.

[0171] The holding member 720″ has the panel supporting portion 721″comprising the recessed groove 721 a″ the same as the configurationexample 1, but storing recesses 722 a″, 722 b″, and 722 c″ differentfrom that of configuration example 1 are formed to the extension facingportion 722″. The storing groove 722 a″ is formed so as to be able tostore the liquid crystal driving IC 715 mounted on the substrateextension portion 711T of the liquid crystal panel 710, the storingrecess 722 b″ is formed so as to be able to store the chip parts 716 aand 716 b, and the storing recess 722 c″ is formed so as to be able tostore the chip parts 716 c and 716 d. In other words, the storingrecesses 722 b″ and 722 c″ are configured so as to be able to storemultiple electronic parts therein.

[0172]FIG. 18 is a disassembled perspective view illustrating thestructure of the liquid crystal device 800 according to a fourthembodiment of the present invention. The liquid crystal device 800 has aliquid crystal panel 810 and a holding member 820. As described above,the liquid crystal panel 810 has the first substrate 811, the secondsubstrate 812, and the sealing material 813, and two liquid crystaldriving ICs 815A and 815B, and chip parts 816, are mounted on thesubstrate extension portion 811T.

[0173] On the other hand, the holding member 820 has the panelsupporting unit 821 with the recessed grove 821 a as described above andextension facing portion 822 having storing recesses 822 a, 822 b, and822 c. The storing recess 822 a formed on the extension facing portion822 is formed so as to be able to accommodate the liquid crystal drivingIC 815A on the substrate extension portion 811T, the storing recess 822b is formed so as to be able to accommodate the chip parts 816, and thestoring recess 822 c is formed so as to be able to accommodate the otherliquid crystal driving IC 815B.

[0174] With this configuration example 4, multiple liquid crystaldriving ICs 815A and 815B are formed on the liquid crystal panel 810,and multiple storing recesses 822 a and 822 c corresponding to theliquid crystal driving ICs are formed accordingly in the holding member820.

[0175] Also, in the event that multiple liquid crystal driving ICs aremounted as with this configuration example 4, a storing recess forstoring the multiple liquid crystal driving ICs together may be providedas with the configuration example 2 and configuration example 3, or astoring recess or storing groove for storing all electronic parts may beprovided.

[0176]FIG. 19 is a disassembled perspective view illustrating thestructure of the liquid crystal device 900 according to a fifthembodiment of the present invention. The liquid crystal device 900 has aliquid crystal panel 910 and a holding member 920. As described above,the liquid crystal panel 910 has the first substrate 911, the secondsubstrate 912, and the seal material 913. The liquid crystal panel 910does not have liquid crystal driving ICs or chip parts mounted on thesubstrate extension portion 911T; the wiring member 917 which is thesame as that described above is directly mounted onto an input terminalarray 911 x formed on the substrate extension portion 911T. Moldmaterial 918 is smoothly formed on the surface of the substrateextension portion 911T.

[0177] On the other hand, as described above, the holding member 920 hasthe panel supporting unit 921 with the recessed grove 921 a and thickextension facing portion 922 having storing openings 922 a and 922 b.The storing openings 922 a and 922 b on the extension facing portion 922are formed so as to be able to accommodate light-emitting elements 931and 932 mounted on the circuit board 930.

[0178] With this configuration example 5, the light-emitting elements931 and 932 are stored in the storing openings 922 a and 922 b of theholding member 920, and light emitted from the light-emitting elements931 and 932 from the inner faces of the openings is introduced into theholding member 920.

[0179]FIG. 20 is a disassembled perspective view illustrating thestructure of the liquid crystal device 1000 according to the presentinvention. The liquid crystal device 1000 has a liquid crystal panel1010 and a holding member 1020 positioned so as be overlaid thereupon.The liquid crystal panel 1010 is formed by attaching the first substrate1011 and the second substrate 1012 one to another with the seal material1013, and sealing liquid crystal therewithin. The liquid crystal drivingIC 1015 is mounted on the substrate extension portion 1011T.

[0180] On the other hand, the holding member 1020 comprises a panelsupporting portion 1021 with the same recessed groove 1021 a asdescribed above, and a substrate extension portion having a storinggrove 1022 a as with the above configuration example 2. A pair oflight-emitting elements 1023 and 1024 are attached and fixed within thestoring grove 1022 a. The configuration is such that when the holdingmember 1020 is positioned in the proper position above the liquidcrystal panel 1010, the light-emitting elements 1023 and 1024 arepositioned on either side of the liquid crystal driving IC 1015 storedin the center storing grove 1022 a. Incidentally, the light-emittingelements 1023 and 1024 attached to the holding member 1020 areelectroconductively connected to the circuit board 1030 via, forexample, unshown wiring.

[0181] With this configuration example 6, the pair of light-emittingelements 1023 and 1023 are attached within the storing grove 1022 aformed in the holding member 1020, and the configuration is such thatthe storing grove 1022 a between the light emitting elements 1023 servesas a storing recess for storing the liquid crystal driving IC 1015.

[0182]FIG. 21 is a disassembled perspective view illustrating thestructure of the liquid crystal device 1000′ according to the presentinvention. The liquid crystal device 1000′ has a liquid crystal panel1010, a holding member 1020′, and a circuit board 1030′. The liquidcrystal panel 1010 is the same as the liquid crystal panel in the aboveconfiguration example 6, so description thereof will be omitted.

[0183] The holding member 1020′ comprises only the panel supportingportion 1021 with the same recessed grove 1021 a′ as above, and theconfiguration does not have the portion facing the substrate extensionportion 1011T of the liquid crystal panel 1010. Also, the pair oflight-emitting elements 1031′ and 1032′ are mounted on the lower surfaceof the circuit board 1030′, as viewed in the figure.

[0184] In this configuration example 7, overlaying the liquid crystalpanel 1010 and circuit board 1030′ with the holding member 1020′introduced therebetween causes the light-emitting elements 1031′ and1032′ mounted on the circuit board 1030′ to be directly opposinglypositioned on the substrate extension portion 1011T of the liquidcrystal panel 1010 as indicated by the chain line in the figure. Theconfiguration is such that, at this time, the light-emitting elements1031′ and 1032′ are adjacently positioned on either side of the liquidcrystal driving IC 1015 mounted on the substrate extension portion1011T. Accordingly, the liquid crystal driving IC 1015 is positionedbetween the pair of light-emitting elements 1031′ and 1032′, so theliquid crystal driving IC and the light-emitting elements are notpositioned overlapping in the thickness direction, thereby allowing thethickness of the liquid crystal device 1000′ to be reduced, and alsosuch an adjacent placement structure of electronic parts serves as aguide for assembly, facilitating positioning, and consequently theassembly work can be carried out in a sure and speedy manner.

[0185] Next, the method for forming mold material on the substrateextension portion of the liquid crystal panel in the above embodiments,variations, and configuration examples, will be described. Theabove-described smooth mold material here can be applied to any of theabove embodiments, variations, and configuration examples, but heredescription will be made using the liquid crystal panel 210 according tothe second embodiment as an example.

[0186]FIG. 22 is a process-describing diagram illustrating a method 1for applying mold material suitable for the present invention (hereaftersimply referred to as “mold method”). With this mold method, first,unhardened mold material 218 x is applied to the surface of thesubstrate extension portion 211T of the liquid crystal panel 210 using adispenser (syringe) DP, as shown in FIG. 22(a).

[0187] Mold material used here may include solvent type (roomtemperature hardening) mold material, ultraviolet-light hardening moldmaterial, or the like. The viscosity of the mold material needs to be arelatively low viscosity in the unhardened state due to later-describedreasons, and preferably is in a range of, for example, around 0.1 to 1.0(Pa·s). If this range is exceeded, it becomes difficult to obtain asmooth laminated form due to insufficient fluidity of the unhardenedmold material 118 x, and under this range handling is difficult since itbecomes difficult to hold onto the substrate extension portion 211T.

[0188] Next, as shown in FIG. 22(b), the entire liquid crystal panel 210is inclined, causing the unhardened mold material 218 x on the substrateextension portion 211T to flow along the surface of the substrate,thereby forming an approximately uniform thickness on the entiresubstrate extension portion 211T except for the mounting area of theliquid crystal driving IC 215.

[0189] At the point that the unhardened mold material 218 x has spreadapproximately uniformly on the substrate extension portion 211T, theliquid crystal panel 210 is returned to the horizontal attitude as shownin FIG. 22(c), and in the event that room temperature hardening moldmaterial is used the article is left standing, and in the event thatultraviolet-light hardening mold material is used ultraviolet-light isirradiated, and in the event that thermal-hardening mold material isused heat is applied, thereby hardening the unhardened mold material 218x and forming the hardened mold material 218.

[0190]FIG. 23 is a process-describing diagram illustrating a mold method2 applicable to the present invention. With this mold method, followingapplying unhardened mold material 218 x to the surface of the substrateextension portion 211T using a dispenser DP or the like as with moldmethod 1 as shown in FIG. 23(a), the mold material 218 x is smoothedwith a squeegee SQ, as shown in FIG. 23(b) (smoothing with squeegee).Subsequently, hardening the unhardened mold material 218 x as with moldmethod 1 yields a mold material 218 having a smooth surface on thesubstrate extension portion 211T, as shown in FIG. 23(c).

[0191] Now, the above mold methods 1 and 2 consist of placing unhardenedmold material 118 x on the substrate of a liquid crystal panel,following which the unhardened mold material 118 is caused to flow onthe substrate so as to smooth the mold material, and methods may be usedother than the above methods of inclining the liquid crystal panel ofmechanically spreading using a squeegee, such as methods smoothing theunhardened mold material using air flow, or the like.

[0192]FIG. 24 is a process-describing diagram illustrating a mold method3 applicable to the present invention. With this mold method, as shownin FIG. 24(a), a mold sheet 218 y, having a planar form approximatelyequal to that of the substrate extension portion 211T of the liquidcrystal panel 210 and having an opening 218 ya of a position and planarform approximately equal to that of the liquid crystal driving IC 215mounted on the substrate extension portion 211T, is used.

[0193] The mold sheet 218 y, following being laid on the substrateextension portion 211T as shown in FIG. 24(b), is softened by heatingprocessing or the like, and fused onto the substrate extension portion211T, thereby becoming a mold material 218 having a smooth surface onthe substrate extension portion 211T, as shown in FIG. 24(c), thuscovering the substrate.

[0194] Finally, description will be made regarding an embodiment ofelectronic equipment using the above liquid crystal device, withreference to FIG. 25 and FIG. 26. FIG. 25 is a schematic configurationdiagram illustrating the configuration of the display system of thepresent embodiment. The electronic equipment illustrated here comprisesthe liquid crystal device illustrated in the above embodiments,variations, and configuration examples (representatively listed asliquid crystal device 100 in the figure), and a display control circuit1100 for controlling this liquid crystal device as a display member.

[0195] The liquid crystal device 100 is configured of a panel member100A including a liquid crystal panel and polarizing plates,back-lights, etc., that go with the liquid crystal panel, and a drivingcircuit 100B for driving the liquid crystal panel. The driving circuit100B is configured of the liquid crystal driving IC mounted on theliquid crystal panel in the above embodiments, variations, andconfiguration examples.

[0196] The display control circuit 1100 comprises a display informationoutput source 1110, a display processing circuit 1120, an electric powersource circuit 1130, and a timing generator 1140.

[0197] The display information output source 1110 comprises memory suchas ROM (Read Only Memory) and RAM (Random Access Memory) and the like, astorage unit of a magnetic recording disk or optical recording disk orthe like, and a synchronizing circuit for performing synchronous outputof digital image signals, and is configured so as to supply displayinformation to a display information processing circuit 72 in the formof image signals or the like of a predetermined format, based on clocksignals of various types generated by the timing generator 1140.

[0198] The display information processing circuit 1120 comprises variousknown circuits such as a serial/parallel conversion circuit,amplifying/inverting circuit, rotation circuit gamma correction circuit,clamp circuit etc., and executes processing of input display informationand supplies the image information to the driving circuit 100B alongwith clock signals CLK. The driving circuit 100B includes a scanningline driving circuit, data line driving circuit, and detecting circuit.Also, the electric power source circuit 1130 supplies predeterminedvoltage to the respective components described above.

[0199]FIG. 26 illustrates a cellular telephone which is an embodiment ofthe electronic equipment relating to the present embodiment. Thiscellular telephone 2000 has a circuit board 2001 placed within a caseunit 2010, and a liquid crystal display device comprising the abovepanel member 100A and driving circuit 100B is mounted on the circuitboard 2001. Operating buttons 2020 are arrayed on the front face of thecase unit 2010, and also an antenna 2030 is attached in an extractablemanner to one end thereof. A speaker is positioned within an earpiece2040, and a microphone is embedded in a mouthpiece 2050.

[0200] The panel member 100A positioned within the case unit 2010 isconfigured such that the display screen (the liquid crystal driving areaformed within the above seal material) can be viewed through a displaywindow 2060.

[0201] Note that the an electro-optical device, the method formanufacturing the electro-optical device, the light guide, the liquidcrystal device, the method for manufacturing the liquid crystal device,and the electronic equipment, according to the present invention, arenot restricted to the above-described examples shown in the figures, andit is needless to say that various modifications can be made withoutdeparting from the spirit and scope of the present invention. Forexample, the present invention is not restricted to the above-describedtransmitting liquid crystal device for the configuration of the liquidcrystal device, and application can be made in the same manner toreflecting liquid crystal devices and semi-transmitting liquid crystaldevices. Also, this is not restricted to dot-matrix type liquid crystaldevices, and wide application of various types of liquid crystal devicescan be made, such as segment type liquid crystal devices and so forth.

[0202] Also, the above descriptions have all been regarding cases ofconfiguring liquid crystal devices, but the present invention can besimilarly applied to various types of electro-optical devices having atleast one electro-optical panel substrate, such as electroluminescencedevices, organic electroluminescence devices, plasma display devices,and so forth.

[0203] According to the present invention as described above, thethickness and weight of electro-optical devices can be reduced, greatlycontributing to reduction in the thickness and weight of various typesof electronic equipment.

What is claimed is:
 1. An electro-optical device, comprising: an electro-optical panel substrate; an electronic part mounted on said electro-optical panel substrate; and a holding member disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein said electronic part is positioned so as to protrude from said electro-optical panel substrate; and wherein said holding member is provided with a storing portion for storing said electronic part.
 2. An electro-optical device according to claim 1, wherein said holding member is configured so as to function as a light guide.
 3. An electro-optical device according to claim 2, wherein said holding member further comprises a light source storing portion for storing a light source.
 4. An electro-optical device according to claim 1, wherein areas surrounding a mounting area of said electronic part on said electro-optical panel substrate are covered with a protective material having a flat face.
 5. An electro-optical device, comprising: an electro-optical panel substrate; an electronic part mounted on said electro-optical panel substrate; and a holding member disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein said electro-optical panel substrate is covered with a protective material having a flat face; and wherein said electronic part is positioned so as to protrude from said protective material on said electro-optical panel substrate; and wherein said holding member is provided with a storing portion for storing said electronic part.
 6. An electro-optical device according to claim 5, wherein said holding member is configured so as to function as a light guide.
 7. An electro-optical device according to claim 6, wherein said holding member further comprises a light source storing portion for storing a light source.
 8. An electro-optical device, comprising: an electro-optical panel substrate; an electronic part mounted on said electro-optical panel substrate; and a holding member disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein a plurality of said electronic parts are mounted on said electro-optical panel substrate; and wherein said plurality of electronic parts are positioned so as to protrude from said electro-optical panel substrate; and wherein said holding member is provided with a storing portion for storing said plurality of electronic parts.
 9. An electro-optical device according to claim 8, wherein said holding member is configured so as to function as a light guide.
 10. An electro-optical device according to claim 9, wherein said holding member further comprises a light source storing portion for storing a light source.
 11. An electro-optical device according to claim 8, wherein a plurality of said storing portions are provided corresponding to said plurality of electronic parts.
 12. An electro-optical device according to claim 11, comprising a plurality of said electronic parts having mutually different shapes or dimensions, and comprising a plurality of said storing portions configured with mutually different shapes or dimensions so as to match the forms of the corresponding electronic parts.
 13. An electro-optical device according to claim 8, wherein said storing portion is configured so as to store said plurality of electronic parts together.
 14. An electro-optical device according to claim 13, wherein said storing portion is configured having a groove shape.
 15. An electro-optical device, comprising: an electro-optical panel substrate; an electronic part mounted on said electro-optical panel substrate; and a holding member disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein said electronic part is positioned so as to protrude from said electro-optical panel substrate; and wherein said holding member is provided with an abutting portion which abuts said electro-optical panel substrate for positioning, and a storing portion for storing said electronic part in a state wherein said electro-optical panel substrate is positioned by said abutting portion.
 16. An electro-optical device according to claim 15, wherein said holding member is configured so as to function as a light guide.
 17. An electro-optical device according to claim 16, wherein said holding member further comprises a light source storing portion for storing a light source.
 18. An electro-optical device according to claim 15, wherein said holding member comprises an elastic holding portion for holding said electro-optical panel substrate in a state abutted against said abutting portion.
 19. An electro-optical device according to claim 15, wherein said holding member is provided with a recessed structure for storing said electro-optical panel substrate, containing said abutting portion.
 20. An electro-optical device, comprising: an electro-optical panel substrate; an electronic part mounted on said electro-optical panel substrate; a holding member disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate, said holding member functioning as a light guide; and a circuit board positioned along said holding member; wherein said electronic part is positioned so as to protrude from said electro-optical panel substrate; and wherein a light source is mounted to said circuit board so as to protrude toward the side of said holding member; and wherein said holding member is provided with a storing portion for storing said electronic part, and a light source storing portion for storing said light source.
 21. An electro-optical device according to claim 20, wherein said light source storing portion is configured so as to accommodate said light source from the opposite side of said electro-optical panel substrate as said holding member.
 22. An electro-optical device according to claim 21, wherein said light source storing portion is assembled in a state with said light source stored therein.
 23. An electro-optical device, comprising: an electro-optical panel substrate; a first electronic part mounted on said electro-optical panel substrate; and a holding member disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein said electronic part is positioned so as to protrude from said electro-optical panel substrate; and wherein said holding member is provided with a storing portion for storing another electronic part at an area adjacent to said electronic part.
 24. An electro-optical device according to claim 23, wherein said other electronic part is attached to said storing portion.
 25. An electro-optical device, comprising: an electro-optical panel substrate; an electronic part mounted on said electro-optical panel substrate; and a circuit board disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein said electronic part is positioned so as to protrude from said electro-optical panel substrate; and wherein another electronic part is mounted to said circuit board at an area adjacent to said electronic part.
 26. An electro-optical device according to claim 25, wherein a holding member is positioned between said electro-optical panel substrate and said circuit board, said holding member comprising a storing portion for storing said electronic part and said other electronic part adjacent thereto.
 27. An electro-optical device according to claim 25, wherein said holding member has a light-guiding function.
 28. An electro-optical device according to claim 27, wherein said other electronic part is a light source.
 29. An electro-optical device according to claim 25, wherein one of said electronic part and said other electronic part is positioned between a pair of the other.
 30. A method for manufacturing an electro-optical device, said method comprising: mounting an electronic part on an electro-optical panel substrate; and disposing a holding member along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein said holding member is provided beforehand with a storing portion for storing said electronic part, and wherein said holding member is positioned such that said storing portion accommodates said electronic part.
 31. A method for manufacturing an electro-optical device according to claim 30, wherein said storing portion accommodates said electronic part in the state that an abutting portion of said holding member which abuts said electro-optical panel substrate for positioning, is abutting said electro-optical panel substrate.
 32. A method for manufacturing an electro-optical device according to claim 30, wherein said electro-optical panel substrate is covered with a protective material following mounting said electronic part on said electro-optical panel substrate.
 33. A method for manufacturing an electro-optical device according to claim 32, wherein said protective material in an unhardened state is applied onto said electro-optical panel substrate, following which said protective material is subjected to smoothing processing for smoothing and subsequently hardened.
 34. A method for manufacturing an electro-optical device according to claim 33, wherein said smoothing processing is performed by inclining said electro-optical panel substrate to cause applied said protective material to flow.
 35. A method for manufacturing an electro-optical device according to claim 33, wherein said applied protective material is mechanically smoothed.
 36. A method for manufacturing an electro-optical device according to claim 32, wherein a sheet-shaped protective material is positioned on said electro-optical panel substrate, following which said sheet-shaped protective material is either dissolved or softened, and following which said protective material is hardened.
 37. A method for manufacturing an electro-optical device according to claim 36, wherein said sheet-shaped protective material is provided with an opening at the mounting area of said electronic part on said electro-optical panel substrate.
 38. A method for manufacturing an electro-optical device, said method comprising: mounting an electronic part on an electro-optical panel substrate; and disposing a circuit board along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein, another electronic part is mounted to an area adjacent to said electronic part on said circuit board, and said circuit board is disposed along said electro-optical panel substrate such that said electronic part and said other electronic part are positioned adjacently.
 39. A method for manufacturing an electro-optical device according to claim 38, wherein a holding member provided with a storing portion for storing said electronic part and said other electronic part adjacent thereto is disposed between said electro-optical panel substrate and said circuit board.
 40. A method for manufacturing an electro-optical device according to claim 38, wherein both said electronic part and said other electronic part are mounted such that one electronic part is positioned between a pair of the other electronic part.
 41. A light guide used in a state disposed so as to cover an electro-optical panel substrate; comprising a storing portion for storing an electronic part mounted on said electro-optical panel substrate and positioned so as to protrude from said electro-optical panel substrate.
 42. A light guide according to claim 41, wherein said storing portion is configured so as to be capable of storing said electronic part from either the front or rear side, and wherein another storing portion is provided so as to be capable of storing a light source from the other side, front or rear.
 43. A light guide according to claim 42, wherein said storing portion is configured so as to be capable of storing said electronic part from either the front or rear side, and wherein said other storing portion is arranged to be capable of storing said light source from the other, front or rear side.
 44. A light guide according to claim 41, further comprising an abutting portion which abuts said electro-optical panel substrate for positioning.
 45. A light guide according to claim 44, further comprising an elastic holding portion for holding said electro-optical panel substrate against said abutting portion in said abutted state.
 46. A light guide according to claim 44, further comprising a recess structure containing said abutting portion, for storing said electro-optical panel substrate.
 47. An electro-optical device, comprising: an electro-optical panel substrate; an electro-optical panel driving IC mounted onto said electro-optical panel substrate; and a holding member disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein said electro-optical panel driving IC is positioned protruding from said electro-optical panel substrate, and said holding member has a recess for storing said electro-optical panel driving IC.
 48. An electro-optical device according to claim 47, wherein said holding member functions as a light guide.
 49. An electro-optical device according to claim 47, wherein a chip part is mounted to said electro-optical panel substrate, said chip part is positioned protruding from said electro-optical panel substrate, and a recess is formed on said holding member for storing said chip part.
 50. An electro-optical device according to claim 49, wherein said recess is a groove provided in said holding member.
 51. An electro-optical device according to claim 49, wherein at said recess, a light source is provided at said holding member side.
 52. An electro-optical device, comprising: an electro-optical panel substrate; an electro-optical panel driving IC mounted onto said electro-optical panel substrate; and a holding member disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein said electro-optical panel driving IC is positioned protruding from said electro-optical panel substrate, and said holding member has a notch provided from the outside at an area where said electro-optical panel driving IC is not situated.
 53. An electro-optical device according to claim 52, wherein said holding member functions as a light guide.
 54. An electro-optical device according to claim 52, wherein a light source is stored in said notch.
 55. An electro-optical device, comprising: an electro-optical panel substrate; an electro-optical panel driving IC mounted onto said electro-optical panel substrate; and a holding member disposed along said electro-optical panel substrate so as to cover said electro-optical panel substrate; wherein said electro-optical panel driving IC is positioned protruding from said electro-optical panel substrate; and wherein said holding member has a hole provided at an area where said electro-optical panel driving IC is not situated.
 56. A light guide disposed along an electro-optical panel substrate upon which an electro-optical panel driving IC is mounted, wherein said electro-optical panel driving IC is attached to said electro-optical panel substrate in a manner protruding therefrom, and a recess is formed in a holding member for storing said protruding electro-optical panel driving IC.
 57. A light guide disposed along an electro-optical panel substrate upon which an electro-optical panel driving IC is mounted, wherein said electro-optical panel driving IC is attached to said electro-optical panel substrate in a manner protruding therefrom, and a notch is provided to said holding member from the outside at an area where said electro-optical panel driving IC is not situated.
 58. An electro-optical device according to claim 55, comprising a liquid crystal device wherein liquid crystal is provided between a pair of liquid crystal panel substrates which are said electro-optical panel substrates.
 59. A liquid crystal device, comprising: a pair of liquid crystal panel substrates with liquid crystal sandwiched therebetween; an electronic part mounted to a substrate extension portion on at least one of said pair of liquid crystal panel substrates which extends further outwards than the outer shape of the other liquid crystal panel substrate; and a holding member provided along said one liquid crystal panel substrate for covering said liquid crystal panel substrate; wherein said electronic part is positioned so as to protrude from said substrate extension portion; and wherein said substrate extension portion is covered with a protective material having a smooth surface; and wherein said holding member is provided with a storing portion for storing said electronic part.
 60. A method for manufacturing an electro-optical device according to claim 30, wherein a liquid crystal device is manufactured by liquid crystal being provided between a pair of liquid crystal panel substrates which are said electro-optical panel substrates.
 61. Electronic equipment comprising: the electro-optical device according to claim 1; and control means for controlling said electro-optical device.
 62. Electronic equipment comprising: the liquid crystal device according to claim 59; and control means for controlling said electro-optical device. 